This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignees: Toppan Inc., Toppan Holdings Inc.. Active years: 2025-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025-2026
Title: Takehisa Takada: Innovator in Wiring Board Manufacturing
Introduction
Takehisa Takada is a prominent inventor based in Tokyo, Japan. He is known for his innovative contributions to the field of wiring board manufacturing. His work has led to advancements that enhance the efficiency and effectiveness of electronic components.
Latest Patents
Takehisa Takada holds a patent for a wiring board manufacturing method. This method includes several steps: forming a laser-modified portion in a glass substrate by applying laser light, creating a first surface wiring layer with a hydrofluoric acid resistant metal film and a copper layer, etching the opposite surface to form a through via, removing etching residues, and finally forming a through electrode in the via. This patent represents a significant advancement in the manufacturing process of wiring boards.
Career Highlights
Takada is currently employed at Toppan Inc., where he continues to develop innovative solutions in wiring board technology. His expertise and dedication to his work have made him a valuable asset to the company.
Collaborations
Throughout his career, Takehisa Takada has collaborated with notable colleagues, including Tomoyuki Ishii and Yuki Umemura. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Takehisa Takada's contributions to wiring board manufacturing exemplify the spirit of innovation. His patented methods are paving the way for advancements in electronic component production.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile