Aichi, Japan

Takehiko Tokuyama

This inventor holds 1 USPTO granted patent. Top assignee: Meinan Machinery Works, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takehiko Tokuyama. Retrieved from https://idiyas.com/inventor/takehiko-tokuyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Takehiko Tokuyama: Inventor of a Plywood Defect Inspection System

Introduction

Takehiko Tokuyama is an inventor based in Aichi, Japan, associated with Meinan Machinery Works, Inc. His work includes a patent for inspecting plywood for defects using depth and shape information.

Latest Patents

Tokuyama is credited with 1 patent: “Defect Inspection System and Defect Inspection Method.” The invention captures images of both faces of plywood as it moves along belt conveyors, generating depth information. Separate shape-measurement units measure the plywood away from the conveyor gap where imaging occurs, helping avoid vibration-related effects. The system uses the shape information to correct the depth data before detecting defects. This approach is designed to identify warpage, bending, and other defects accurately without flattening or otherwise deforming the plywood during correction.

Career Highlights

Tokuyama’s listed patent reflects work on inspection technology for plywood manufacturing. By combining image-based depth data with independent shape measurements, the system addresses the challenge of detecting defects in material moving through production equipment.

Collaborations

Tokuyama’s listed coworkers include Masamichi Iwamoto and Keijiro Yamaguchi. His patent is associated with Meinan Machinery Works, Inc.

Conclusion

Takehiko Tokuyama’s patent describes a method for improving plywood defect detection by correcting depth information with shape measurements taken away from conveyor vibrations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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