Takayuki Tokunaga

Title: Takayuki Tokunaga: Innovator in Wiring Substrate Technology

Introduction

Takayuki Tokunaga is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of wiring substrate technology. His innovative work has led to the development of a unique patent that enhances the manufacturing process of wiring substrates.

Latest Patents

Takayuki Tokunaga holds a patent for a wiring substrate and the method for manufacturing it. The patent describes a wiring substrate that includes a substrate body with a first and second substrate surface. It features a trench open toward the first substrate surface, which has an inner bottom surface and an inner side surface. Additionally, the design includes a through-hole that communicates with the inner bottom surface of the trench and is open toward the second substrate surface. The invention also incorporates a first conductive layer, a second conductive layer, and a third conductive layer, all working together to improve the functionality of the wiring substrate.

Career Highlights

Tokunaga is associated with Shinko Electric Industries Co., Ltd., where he has been able to apply his expertise in wiring substrate technology. His work at the company has allowed him to contribute to advancements in electronic components and materials.

Collaborations

Throughout his career, Takayuki Tokunaga has collaborated with notable colleagues, including Masahiro Sunohara and Hedeaki Sakaguchi. These collaborations have fostered innovation and development in their respective fields.

Conclusion

Takayuki Tokunaga's contributions to wiring substrate technology exemplify the impact of innovative thinking in the electronics industry. His patent and work at Shinko Electric Industries Co., Ltd. highlight his role as a key inventor in this specialized field.