The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2013

Filed:

Jun. 20, 2011
Applicants:

Masahiro Sunohara, Grenoble Cedex, FR;

Takayuki Tokunaga, Nagano, JP;

Hedeaki Sakaguchi, Nagano, JP;

Akihito Takano, Nagano, JP;

Inventors:

Masahiro Sunohara, Grenoble Cedex, FR;

Takayuki Tokunaga, Nagano, JP;

Hedeaki Sakaguchi, Nagano, JP;

Akihito Takano, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring substrate includes a substrate body including a first substrate surface and a second substrate surface, a trench being open toward the first substrate surface, the trench having an inner bottom surface and an inner side surface, a through-hole having a first end communicating with the inner bottom surface of the trench and a second end being open toward the second substrate surface, a first conductive layer having a first surface toward the trench and being filled inside at least a portion of the through-hole from the second end, a second conductive layer covering the first surface and at least a part of the inner bottom surface of the trench, and a third conductive layer covering the second conductive layer and being filled inside the trench.


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