This inventor holds 1 USPTO granted patent. Top assignee: Showa Denko Materials Co., Ltd.. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Takayuki Suzukawa: Innovator in Multilayer Printed Circuit Board Technology.
Introduction
Takayuki Suzukawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of multilayer printed circuit boards, showcasing his expertise through innovative patents.
Latest Patents
Suzukawa holds a patent for a resin film designed for interlayer insulating layers in multilayer printed circuit boards. The patent describes a support-attached resin film that includes a support and a resin composition layer. This layer is formed on one side of the support, which may have exposed particles with an average maximum height of 1.0 µm or less. Alternatively, the support may have no exposed particles. This invention enhances the manufacturing process of multilayer printed wiring boards.
Career Highlights
Takayuki Suzukawa is associated with Showa Denko Materials Co., Ltd., where he applies his knowledge and skills in developing advanced materials for electronic applications. His work has been instrumental in improving the performance and reliability of printed circuit boards.
Collaborations
Suzukawa collaborates with notable colleagues, including Ikuo Sugawara and Tetsurou Irino, who contribute to his projects and innovations in the field.
Conclusion
Takayuki Suzukawa's contributions to multilayer printed circuit board technology exemplify his innovative spirit and dedication to advancing electronic materials. His patent reflects a significant step forward in the industry, showcasing the importance of research and development in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile