Kanagawa, Japan

Takayuki Morino

This inventor holds 37 USPTO granted patents and 1 published patent application and 2 EPO patents, primarily in Electronic Apparatus. Top assignees: Lenovo (Singapore) Pte. Ltd., International Business Machines Corporation. Active years: 2002-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takayuki Morino. Retrieved from https://idiyas.com/inventor/takayuki-morino

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 37 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.2

ph-index = 8

Forward Citations = 160(Granted Patents)


Location History:

  • Kanagawa-ken, JP (2013 - 2014)
  • Yamato, JP (2002 - 2016)
  • Yokohama, JP (2018 - 2023)
  • Kanagawa, JP (2020 - 2023)

Company Filing History:


Years Active: 2002-2026

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Areas of Expertise:
Electronic Apparatus
Display Assembly
Foldable Devices
Portable Information Device
Chassis Member
Flexible Display
Smart Drain Hole
Antenna Mounting
Shock Absorbing Connector
Casing Structure
High Volume Ventilation Fan
Manufacturing Method
37 patents (USPTO):Explore Patents

Title: Innovations of Takayuki Morino: A Leader in Electronic Apparatus Design

Introduction

Takayuki Morino is a prominent inventor based in Kanagawa, Japan, known for his significant contributions to electronic apparatus design. With an impressive portfolio of 21 patents, Morino has made remarkable advancements in innovative technology, particularly in the field of electronic devices.

Latest Patents

Morino's recent patents showcase his expertise in designing electronic apparatuses. One of his inventions features a unique configuration that includes a first chassis housing a first electronic component and a second chassis for a second electronic component. This electronic apparatus is notable for its hinge mechanism, which enables relative rotation between the two chassis, and incorporates a flexible board that connects both components efficiently. This design allows for optimized space utilization while maintaining functionality.

Another recent patent introduces an electronic apparatus designed with a heat-generating element within the first chassis. It includes a hinge device that allows the first and second chassis to rotate between a 0-degree and 180-degree attitude. A significant feature of this invention is the flexible heat conductive member present within the first chassis, connecting a heat receiving member to the first support plate, thereby ensuring effective thermal management.

Career Highlights

Throughout his career, Takayuki Morino has worked for reputable companies such as Lenovo (Singapore) Pte. Ltd. and International Business Machines Corporation (IBM), where he has been instrumental in developing innovative electronic solutions that push the boundaries of technology. His work in these organizations has enabled him to refine his skills in design and engineering, leading to his successful patent portfolio.

Collaborations

In addition to his individual achievements, Morino has collaborated with other talented inventors, including Seita Horikoshi and Akinori Uchino. These partnerships have allowed for a creative exchange of ideas and expertise, further enhancing the innovation process and leading to the development of groundbreaking electronic apparatus designs.

Conclusion

Takayuki Morino stands out as a pioneering inventor in the field of electronic apparatuses. His numerous patents and collaborative efforts reflect his commitment to advancing technology and innovation. With each invention, Morino continues to impact the industry, paving the way for future advancements in electronic design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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