Musashi Murayama, Japan

Takayuki Iiyama


Average Co-Inventor Count = 2.9

ph-index = 3

Forward Citations = 40(Granted Patents)


Location History:

  • Tokyo, JP (1994 - 1995)
  • Musashimurayama, JP (1998 - 2000)

Company Filing History:


Years Active: 1994-2000

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4 patents (USPTO):Explore Patents

Title: Takayuki Iiyama: Innovator in Wire Bonding Technology

Introduction

Takayuki Iiyama is a notable inventor based in Musashi Murayama, Japan. He has made significant contributions to the field of wire bonding technology, holding a total of 4 patents. His innovative designs have enhanced the efficiency and effectiveness of wire bonding processes in various applications.

Latest Patents

One of Iiyama's latest patents is a wire cutting and feeding device for use in wire bonding apparatus. This device utilizes piezo-electric actuators as the driving source for a slide block that moves a wire clamper toward and away from a workpiece. The piezo-electric actuators include a feeding actuator that causes the slide block to expand and contract, along with two clamping actuators that alternately operate to secure the slide block. The movement of the slide block is controlled through specific power combinations of these actuators. Another significant patent is a clamping device designed for bonding machines. This device employs a piezo-electric element to open and close a pair of clamping claws that hold bonding wires. It features a pressure adjustment screw that applies preparatory pressure to the piezo-electric element, ensuring precise control during the bonding process.

Career Highlights

Takayuki Iiyama is currently associated with Kabushiki Kaisha Shinkawa, a company known for its advancements in manufacturing technology. His work has been instrumental in developing innovative solutions that improve wire bonding techniques, making them more reliable and efficient.

Collaborations

Iiyama has collaborated with several talented individuals in his field, including Minoru Torihata and Koichi Harada. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Takayuki Iiyama's contributions to wire bonding technology exemplify his innovative spirit and dedication to advancing the field. His patents reflect a commitment to improving manufacturing processes, and his collaborations with other experts further enhance his impact on the industry.

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