The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 1994
Filed:
Mar. 12, 1993
Applicant:
Inventors:
Nobuto Yamazaki, Tokyo, JP;
Koichi Harada, Tokyo, JP;
Minoru Torihata, Tokyo, JP;
Mitsuaki Sakakura, Tokyo, JP;
Takayuki Iiyama, Tokyo, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228-45 ; 228 495 ;
Abstract
A pair of clamping arms of a wire clamper used in a wire bonding apparatus being opened and closed via the electric strain effect or magnetic strain effect of a piezoelectric element. With the use of a piezoelectric element that expands when energized to open the clamping arms so as to release the wire held by the clamping arms, the overall weight of the wire clamper can be small, a quick clamping action is secured and the clamping force which is easily adjustable can be steady at a set value.