This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Neomax Materials Co., Ltd.. Active years: 2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013
Title: Takayuki Furujo: Innovator in Airtightly Sealing Technology
Introduction
Takayuki Furujo is a notable inventor based in Izumi, Japan. He has made significant contributions to the field of electronic component packaging. His innovative work focuses on improving the efficiency and effectiveness of sealing technologies.
Latest Patents
Furujo holds a patent for an "Airtightly sealing cap, electronic component storing package and method for manufacturing electronic component storing package." This invention provides an airtightly sealing cap that reduces the use of gold in soldering materials for miniaturized electronic component storing packages. The design includes a base material, a base layer containing nickel, and a soldering material layer composed of gold and tin. The soldering material layer has a thickness of 10 micrometers or less, with gold content ranging from 43 mass % to 64 mass %.
Career Highlights
Furujo is associated with Neomax Materials Co., Ltd., where he continues to develop innovative solutions in electronic component packaging. His work has been instrumental in advancing the technology used in the industry.
Collaborations
Furujo collaborates with Masaharu Yamamoto, contributing to the development of new technologies and enhancing the capabilities of their projects.
Conclusion
Takayuki Furujo's contributions to the field of electronic component packaging demonstrate his commitment to innovation and efficiency. His patented technology is a testament to his expertise and dedication to advancing the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile