The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2013
Filed:
Feb. 19, 2008
Masaharu Yamamoto, Izumi, JP;
Takayuki Furujo, Izumi, JP;
Masaharu Yamamoto, Izumi, JP;
Takayuki Furujo, Izumi, JP;
Neomax Materials Co., Ltd., Suita-shi, JP;
Abstract
Provided is an airtightly sealing cap, by which a use quantity of Au is reduced in a soldering material for sealing a miniaturized electronic component storing package. An airtightly sealing cap () is used for an electronic component storing package () which includes an electronic component storing member () for storing an electronic component (). The airtightly sealing cap is provided with a base material (); a base layer () which is formed on the surface of the base material and contains Ni; and a soldering material layer (), which is formed on the base layer, has a thickness of 10 μm or less and composed of Au and Sn. The content percentage of Au in the soldering material layer is 43 mass % or more but not more than 64 mass %.