This inventor holds 1 USPTO granted patent. Top assignee: Taiyo Yuden Co., Ltd.. Active years: 2007.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2007
Title: Takatoshi Murota and His Printed Wiring Board Invention.
Introduction
Takatoshi Murota is an inventor based in Nakamuroda Haruna-Machi, Japan, associated with Taiyo Yuden Co., Ltd. His work includes a patent for a multilayer printed wiring board and its production method.
Latest Patents
Murota’s patent, “Multilayer Printed Wiring Board and Production Method Therefor,” describes a multilayer board built from multiple insulation layers. Via holes, which electrically connect conductor circuits on the base or adjacent layers, are formed by patterning conductive metal foil. Their height depends on the thickness of the original foil, allowing the vias to be made without conductive-paste filling or electrolytic plating. The method is intended to produce via holes with smooth end faces and avoid defects such as swelling or recession. The supplied information lists 1 patent for Murota.
Career Highlights
Murota’s listed invention addresses the manufacture and quality of electrical connections within multilayer printed wiring boards. His work is associated with Taiyo Yuden Co., Ltd.
Collaborations
Murota’s listed coworkers include Masashi Miyazaki and Mitsuhiro Takayama.
Conclusion
Takatoshi Murota’s patent presents a metal-foil patterning approach for producing consistent via holes in multilayer printed wiring boards, with the goal of improving their quality and simplifying manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile