IDiyas

For the Inventor, By the Inventor

Fukuoka, Japan

Takatoshi Ishikawa

USPTO Granted Patents = 14

Average Co-Inventor Count = 2.1

ph-index = 5

Forward Citations = 65(Granted Patents)


Location History:

  • Furukawa, JP (1988 - 1992)
  • Yamanashi, JP (2016)
  • Fukuoka, JP (1993 - 2020)

Company Filing History:

goldMedal7 out of 4,048 
 
Alps Electric Co., Ltd.
 patents
silverMedal5 out of 27,375 
 
Matsushita Electric Industrial Co., Ltd.
 patents
bronzeMedal2 out of 13,247 
 
Panasonic Intellectual Property Management Co., Ltd.
 patents

Years Active: 1988-2020

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14 patents (USPTO):Explore Patents
1. 10636762 - Method of manufacturing semiconductor device (2020-04-28),
2. 9530680 - Method of fabricating semiconductor package, semiconductor chip supporting carrier and chip mounting device (2016-12-27),
3. 7191511 - Electronic component placement machine having camera units with vertically overlaid apertures (2007-03-20),
4. 7007377 - Electronic component placement method (2006-03-07),
5. 6543669 - Bonding apparatus and bonding tool for component (2003-04-08),
6. 6497354 - Bonding apparatus and bonding tool for component (2002-12-24),
7. 6193143 - Solder bump forming method and mounting apparatus and mounting method of solder ball (2001-02-27),
8. 5182574 - Thermal head (1993-01-26),
9. 5156896 - Silicon substrate having porous oxidized silicon layers and its (1992-10-20),
10. 5091061 - Silicon substrate having porous oxidized silicon layers and its (1992-02-25),
11. 4965610 - Ink-jet recording method (1990-10-23),
12. 4929968 - Printing head assembly (1990-05-29),
13. 4751518 - Heating resistor as a thermal head resistive element (1988-06-14),
14. 4742361 - Thermal print head (1988-05-03),
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