The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2007
Filed:
Jan. 12, 2005
Kazuhiko Noda, Fukuoka, JP;
Hitoshi Mukojima, Fukuoka, JP;
Yasuhiro Narikiyo, Fukuoka, JP;
Toshiro Hirakawa, Fukuoka, JP;
Hiromi Kanaki, Fukuoka, JP;
Akira Nishimura, Fukuoka, JP;
Osamu Uchida, Fukuoka, JP;
Takatoshi Ishikawa, Fukuoka, JP;
Kazuhiko Noda, Fukuoka, JP;
Hitoshi Mukojima, Fukuoka, JP;
Yasuhiro Narikiyo, Fukuoka, JP;
Toshiro Hirakawa, Fukuoka, JP;
Hiromi Kanaki, Fukuoka, JP;
Akira Nishimura, Fukuoka, JP;
Osamu Uchida, Fukuoka, JP;
Takatoshi Ishikawa, Fukuoka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.