San Diego, CA, United States of America

Takatoshi Irie

This inventor holds 2 USPTO granted patents. Top assignee: Kyocera America, Inc.. Active years: 1994-1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takatoshi Irie. Retrieved from https://idiyas.com/inventor/takatoshi-irie

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1994-1996

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Takatoshi Irie: Innovator in Multi-Layer Ceramic Packages

Introduction

Takatoshi Irie is a prominent inventor based in San Diego, CA (US). He has made significant contributions to the field of multi-layer ceramic packages, holding 2 patents that showcase his innovative methods. His work focuses on improving manufacturing processes and efficiency in electronic components.

Latest Patents

One of Takatoshi Irie's latest patents is a method for making multi-layer ceramic packages. This method involves attaching contact pins to a ceramic substrate after applying an intermediate metal layer and an outer metal layer. By eliminating the need to plate the contact pins with these layers, the process saves both material and time. This innovation enhances the overall efficiency of manufacturing multi-layer ceramic packages.

Career Highlights

Takatoshi Irie is currently associated with Kyocera America, Inc., where he continues to develop and refine technologies related to ceramic packaging. His expertise in this area has positioned him as a key player in advancing electronic component manufacturing.

Collaborations

Takatoshi has collaborated with notable professionals in his field, including his coworker Nobuaki Miyauchi. Their combined efforts contribute to the ongoing innovation and development of ceramic packaging technologies.

Conclusion

Takatoshi Irie's work in multi-layer ceramic packages exemplifies the spirit of innovation in the electronics industry. His patents reflect a commitment to improving manufacturing processes, ultimately benefiting the field as a whole.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…