Company Filing History:
Years Active: 1996-1997
Title: Innovator Takashi Sugiyama: Pioneering Multilayer Printed Wiring Board Technologies
Introduction: Takashi Sugiyama, a prominent inventor based in Shimodate, Japan, has made significant strides in the field of printed wiring boards. With two patents to his name, his work stands at the intersection of innovation and practicality, particularly in enhancing the reliability and efficiency of electronic components.
Latest Patents: Among Takashi Sugiyama’s latest patents is a groundbreaking process for forming a multilayer printed wiring board. This process involves integrally laminating a variety of insulating circuit boards, which are equipped with circuits on insulating substrates, alongside interlaminar insulating layers placed between these boards. By ensuring that the difference between the glass transition point of an interlaminar insulating layer and that of the adjoining insulating substrate does not exceed 60 degrees Celsius, the design achieves outstanding proof against exfoliation due to thermal history. The resulting board demonstrates high reliability in insulation and through-hole connections, showcasing the innovative characteristics of these multilayer printed wiring boards.
Career Highlights: Takashi’s association with Hitachi Chemical Company, Ltd. has been instrumental in advancing technology related to printed wiring boards. His inventions focus on maximizing electrical connection reliability while minimizing the chances of material failure, setting a high standard in the industry.
Collaborations: Throughout his career, Takashi Sugiyama has collaborated with talented professionals such as Yoshiyuki Tsuru and Shigeharu Arike. Their collective efforts have driven forward notable advancements in the technical landscape of multilayer circuit boards.
Conclusion: As an inventor, Takashi Sugiyama’s contributions to the realm of multilayer printed wiring board technologies reflect a deep understanding of material science and electrical engineering. His innovative approaches promise to pave the way for future developments in the electronics industry, enhancing the performance and durability of electronic devices.