Saitama, Japan

Takashi Moriya

This inventor holds 13 USPTO granted patents and 2 published patent applications, primarily in Fuel Cell Technology. Top assignees: Honda Giken Kogyo Kabushiki Kaisha, Dic Corporation. Active years: 1987-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takashi Moriya. Retrieved from https://idiyas.com/inventor/takashi-moriya-uuwukpe3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 13 

% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 8

Forward Citations = 256(Granted Patents)


Location History:

  • Utsunomiya, JP (2001 - 2003)
  • Saitama, JP (1987 - 2023)
  • Kitaadachi-gun, JP (2023)

Company Filing History:


Years Active: 1987-2023

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Areas of Expertise:
Sealant Film
Laminated Film
Packaging Material
Solid Polymer Electrolyte
Fuel Cell System
Energization Control
Electromagnetic Control
Internal Combustion Engine
Variable Valve Actuation
Engine Block Construction
Water Pump System
Overhead Cam
13 patents (USPTO):Explore Patents

Title: Takashi Moriya: Innovator in Sealant and Packaging Technologies

Introduction

Takashi Moriya is a prominent inventor based in Saitama, Japan. He has made significant contributions to the field of packaging materials and sealant films. With a total of 13 patents to his name, Moriya's work has had a substantial impact on the industry.

Latest Patents

Moriya's latest patents include innovative technologies such as sealant films, laminate films, and packaging materials. One of his notable inventions is a sealant film that features a unique structure comprising a surface resin layer (A), an adhesive resin layer (B), a release resin layer (C), and a heat seal resin layer (D). The adhesive resin layer (B) incorporates a thermoplastic elastomer and a tackifier resin, while the release resin layer (C) contains a high concentration of ethylene ionomer with specific polar group concentrations. Additionally, the heat seal resin layer (D) is formulated with an ethylene resin, showcasing Moriya's expertise in multilayer film technology.

Career Highlights

Throughout his career, Moriya has worked with notable companies such as Honda Giken Kogyo Kabushiki Kaisha and Dic Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects in the packaging sector.

Collaborations

Moriya has collaborated with esteemed colleagues, including Yasuyuki Komatsu and Hiroshi Sono. These partnerships have further enhanced his ability to innovate and develop cutting-edge technologies in his field.

Conclusion

Takashi Moriya's contributions to sealant and packaging technologies demonstrate his commitment to innovation and excellence. His extensive patent portfolio reflects his significant impact on the industry, making him a noteworthy figure in the realm of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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