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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11692086 B1

PDFFull Text
Date of Patent:
Jul. 04, 2023

Filed:

Jul. 07, 2020

Multilayer film, laminated film, and packaging

Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Takashi Moriya, Saitama, JP;

Tomohisa Kida, Saitama, JP;

Assignee:

DIC CORPORATION, Tokyo, JP;

Attorney:

Whda, LLP

Primary Examiner:

Lawrence D Ferguson

Int. Cl.
CPC ...
B32B 27/08 (2006.01); C08L 23/06 (2006.01); B32B 5/02 (2006.01); B32B 15/085 (2006.01); B32B 15/20 (2006.01); B32B 27/10 (2006.01); B32B 27/12 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 29/00 (2006.01); B32B 27/16 (2006.01);
U.S. Cl.
CPC ...
C08L 23/06 (2013.01); B32B 5/022 (2013.01); B32B 15/085 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/12 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 29/00 (2013.01); B32B 27/16 (2013.01); B32B 2270/00 (2013.01); B32B 2307/306 (2013.01); B32B 2307/31 (2013.01); B32B 2307/518 (2013.01); B32B 2307/732 (2013.01); B32B 2439/02 (2013.01);
Abstract

The multilayer film of the present disclosure has at least a heat-sealing layer and a support layer formed on one side of the heat-sealing layer, wherein the first resin composition forming the heat-sealing layer comprises (a) high-density polyethylene, (b) a propylene random copolymer, and (c) a 1-butene polymer, wherein the content of the component (a) is 30 to 60% by mass, the content of the component (b) is 8 to 42% by mass, and the content of the component (c) is 16 to 56% by mass, wherein the component (a) has a melt flow rate of 10 to 30 g/10 minutes at 190° C., the component (b) has a melt flow rate of 8 to 20 g/10 minutes at 230° C., and the component (c) has a melt flow rate of 0.3 to 3 g/10 minutes at 190° C.

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Moriya, Takashi. (2023). Multilayer film, laminated film, and packaging (U.S. Patent No. 11692086). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11692086

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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