Tokyo, Japan

Takashi Kamiharako

This inventor holds 5 USPTO granted patents. Top assignees: Kaijo Corporation, Kaijo Denki Co. Ltd., View Engineering, Inc.. Active years: 1989-1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takashi Kamiharako. Retrieved from https://idiyas.com/inventor/takashi-kamiharako

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.2

ph-index = 5

Forward Citations = 115(Granted Patents)


Company Filing History:


Years Active: 1989-1996

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5 patents (USPTO):Explore Patents

Title: **The Innovations of Takashi Kamiharako: A Pioneer in Wire Bonding Technology**

Introduction

Takashi Kamiharako, based in Tokyo, Japan, is an esteemed inventor known for his contributions to the field of wire bonding technology. With a remarkable portfolio of 5 patents, he has made significant advancements that enhance the efficiency and effectiveness of electronic manufacturing processes.

Latest Patents

Among Takashi Kamiharako's latest innovations are his patents for a wire bonder and wire bonding method. These inventions provide an apparatus and method that intelligently utilizes positional data, such as coordinates stored in advance within a bonder. The advanced wire bonding technology compares and evaluates image data from bonding points, assessing whether a bonded indentation is present within a specified range. This automated inspection and correction process showcases the ingenuity and practical application of Kamiharako's work in the industry.

Career Highlights

Throughout his career, Takashi has worked with notable companies, including Kaijo Corporation and View Engineering, Inc. His tenure at these organizations has allowed him to apply his innovative ideas in practical settings, leading to the development of patents that have greatly benefited the technology sector.

Collaborations

In addition to his work, Takashi Kamiharako has collaborated with talented individuals in the field, such as Kimiji Nishimaki and Valerie A. Liudzius. These partnerships have fostered a creative environment that encourages the ongoing development of cutting-edge technologies in wire bonding.

Conclusion

With his impressive track record of patents and collaborations, Takashi Kamiharako is a prominent figure in the realm of innovations related to wire bonding technology. His commitment to advancing the field continues to influence the manufacturing processes of electronic components, solidifying his legacy as an influential inventor in Japan and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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