Osaka, Japan

Takashi Akiguchi


Average Co-Inventor Count = 3.2

ph-index = 7

Forward Citations = 147(Granted Patents)


Company Filing History:


Years Active: 1992-2006

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9 patents (USPTO):Explore Patents

Title: The Innovations of Takashi Akiguchi

Introduction

Takashi Akiguchi is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of nine patents. His work focuses on innovative methods for manufacturing semiconductor device packages, which are crucial for modern electronic devices.

Latest Patents

Among his latest patents is a method for manufacturing semiconductor device packages. This method involves forming a bump on each element electrode of a semiconductor device. A thermoplastic resin sheet is then aligned with the semiconductor device. The sheet and the semiconductor device undergo hot pressing to melt the sheet, creating a thermoplastic resin portion that covers areas other than the end surface of each bump. The resulting thermoplastic resin portion is then cut to complete the package. This innovative approach enhances the efficiency and reliability of semiconductor devices.

Career Highlights

Takashi Akiguchi has spent a significant part of his career at Matsushita Electric Industrial Co., Ltd. His work has been instrumental in advancing semiconductor packaging technologies. His expertise and innovative methods have positioned him as a key figure in the industry.

Collaborations

Throughout his career, Akiguchi has collaborated with notable colleagues, including Kazuhiro Mori and Norihito Tsukahara. These collaborations have fostered a creative environment that has led to groundbreaking advancements in semiconductor technology.

Conclusion

Takashi Akiguchi's contributions to semiconductor device packaging have made a lasting impact on the industry. His innovative methods and collaborative spirit continue to inspire advancements in technology.

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