The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 2004
Filed:
Mar. 28, 2001
Applicant:
Inventors:
Hidenori Miyakawa, Moriguchi, JP;
Yoshio Maruyama, Kyoto, JP;
Hiroshi Yamauchi, Katano, JP;
Mikiya Nakata, Suita, JP;
Takashi Akiguchi, Osaka, JP;
Yoshinori Wada, Suita, JP;
Kazuhiro Mori, Katano, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 ;
U.S. Cl.
CPC ...
H05K 3/30 ;
Abstract
A package is formed by covering a circuit board with a thermoplastice film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.