This inventor holds 1 USPTO granted patent. Top assignee: Ibiden Company Limited. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Takanori Doi: Innovator in Wiring Substrate Manufacturing
Introduction
Takanori Doi is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of wiring substrate manufacturing. His innovative methods have paved the way for advancements in electronic components.
Latest Patents
Takanori Doi holds a patent for a "Method for manufacturing wiring substrate." This method involves several steps, including forming a plating film on a metal foil laminated on an insulating layer, creating an etching resist with an opening for a conductor pattern, and conducting both first and second etching processes to form a conductor layer on the insulating surface. This patent showcases his expertise in enhancing manufacturing processes in electronics.
Career Highlights
Doi is associated with Ibiden Company Limited, where he applies his skills and knowledge to develop innovative solutions in wiring substrate technology. His work has been instrumental in improving the efficiency and effectiveness of manufacturing processes within the company.
Collaborations
Takanori Doi collaborates with Shinichiro Ichikawa, a fellow innovator in the field. Their partnership has led to the exploration of new ideas and techniques in wiring substrate manufacturing.
Conclusion
Takanori Doi's contributions to the field of wiring substrate manufacturing highlight his role as an influential inventor. His patent and collaboration with other professionals demonstrate his commitment to innovation and excellence in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile