Otsu, Japan

Takamitsu Yamada

This inventor holds 1 USPTO granted patent. Top assignee: Toray Engineering Company, Limited. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takamitsu Yamada. Retrieved from https://idiyas.com/inventor/takamitsu-yamada-bo0yzrtx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: The Innovations of Takamitsu Yamada

Introduction: Takamitsu Yamada is a notable inventor based in Otsu, Japan. He has made significant contributions to the field of additive manufacturing and structural engineering. His work focuses on methods that enhance the prediction of structural strength, which is crucial for various engineering applications.

Latest Patents: Takamitsu Yamada holds a patent for a method that predicts the strength of structures modeled by additive manufacturing techniques. This innovative method involves acquiring a material layering method that includes parameters such as scanning direction, scanning pitch, layering direction, and layering pitch. By factoring in strength anisotropy attributable to the material layering method, this approach allows for more accurate estimations of structural strength.

Career Highlights: Yamada is currently employed at Toray Engineering Company, Limited, where he applies his expertise in engineering and materials science. His work at Toray has positioned him as a key player in advancing additive manufacturing technologies.

Collaborations: One of his notable collaborators is Keiko Suda, with whom he has worked on various projects related to structural engineering and additive manufacturing.

Conclusion: Takamitsu Yamada's innovative methods in predicting structural strength represent a significant advancement in the field of engineering. His contributions continue to influence the development of more reliable and efficient additive manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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