Takamitsu Harada

Title: The Innovations of Takamitsu Harada

Introduction

Takamitsu Harada is a notable inventor based in Miyazaki, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 4 patents. His work focuses on methods that enhance the efficiency and quality of semiconductor wafers.

Latest Patents

Harada's latest patents include a "Method for Fabricating Semiconductor Wafers" and a "Method of Manufacturing a Semiconductor Wafer." The first patent discloses a method for efficiently fabricating semiconductor wafers with good planarization without utilizing high etching rate chemical solutions. This method involves slicing a single-crystal ingot into wafer slices, chamfering the edges, and performing lapping or grinding steps to achieve planarization. The wafers are then polished and cleaned to ensure high quality.

The second patent provides a process for precisely and efficiently manufacturing semiconductor wafers. This method prevents contamination by metals within silicon crystals and addresses factors that degrade the GOI produced during manufacturing. The process includes lapping, etching, primary polishing, and finish polishing, followed by washing with an SC-1 solution to ensure cleanliness.

Career Highlights

Takamitsu Harada is currently employed at Komatsu Electronic Metals Co., Ltd., where he continues to innovate in semiconductor technology. His expertise in wafer fabrication has positioned him as a key figure in the industry.

Collaborations

Harada has collaborated with notable colleagues such as Masahiko Maeda and Fumitaka Kai, contributing to advancements in semiconductor manufacturing techniques.

Conclusion

Takamitsu Harada's contributions to semiconductor technology through his innovative patents and career at Komatsu Electronic Metals Co., Ltd. highlight his importance in the field. His work continues to influence the efficiency and quality of semiconductor wafer production.