Tokyo, Japan

Takamasa Takano

This inventor holds 26 USPTO granted patents and 6 published patent applications and 1 EPO patent, primarily in Through-Hole Electrode Substrates. Top assignee: Dai Nippon Printing Co., Ltd.. Active years: 2012-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takamasa Takano. Retrieved from https://idiyas.com/inventor/takamasa-takano

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 96.2

 

Average Co-Inventor Count = 1.9

ph-index = 4

Forward Citations = 62(Granted Patents)


Location History:

  • Tokyo-to, JP (2021 - 2023)
  • Tokyo, JP (2012 - 2024)

Company Filing History:


Years Active: 2012-2025

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Areas of Expertise:
Through Electrode Substrate
Multi-Layer Line Structure
Semiconductor Device
Wiring Substrate
Detection Element
Sensor Device
Manufacturing Method
Production Method
Through-Hole Electrode
Mounting Substrate
Line Structure
Method of Manufacturing
26 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Takamasa Takano in Semiconductor Technology

Introduction

Takamasa Takano, a prolific inventor based in Tokyo, Japan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 24 patents, Takano's work focuses primarily on advanced materials and structures that enhance the functionality and efficiency of electronic devices.

Latest Patents

Takamasa's latest patents showcase his expertise in creating innovative components essential for modern semiconductor design. One of his notable inventions is the "Through Electrode Substrate and Semiconductor Device." This technology features a substrate that includes through electrodes penetrating the material, along with a complex capacitor structure designed to enhance electrical connectivity. The first conductive layer is arranged on the substrate's surface, and its unique insulating layers serve to optimize performance in various electronic applications.

Another patent titled "Through Electrode Substrate and Mounting Substrate" focuses on the integration of substrates with through holes and wiring structures. This design incorporates both organic and inorganic layers to ensure effective insulation and conductivity. His innovations in these areas highlight the importance of materials science in improving the reliability and efficiency of semiconductor devices.

Career Highlights

Takamasa Takano's career has been marked by his dedication to advancing semiconductor technology. His work at Dai Nippon Printing Co., Ltd. has allowed him to collaborate with leading minds in the field. His inventive spirit and technical knowledge have earned him recognition among his peers and the broader scientific community.

Collaborations

Takamasa frequently collaborates with talented colleagues such as Hiroshi Kudo and Shinji Maekawa. These partnerships enable him to push the boundaries of innovation, sharing insights and expertise to develop groundbreaking technologies that meet the demands of the fast-evolving electronics market.

Conclusion

Takamasa Takano stands out as a key figure in semiconductor innovation, with a track record of creating patents that significantly enhance electronic device performance. His contributions at Dai Nippon Printing Co., Ltd. and collaborative efforts with fellow inventors underline the importance of teamwork in driving technological advancement. As the field of semiconductor technology continues to grow, Takano's work will undoubtedly play a pivotal role in shaping the future of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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