Machida, Japan

Takai Shimura


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 1986

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1 patent (USPTO):Explore Patents

Title: Innovator Spotlight: Takai Shimura and His Ultrasonic Sector-Scan Probe

Introduction: Takai Shimura, based in Machida, Japan, is a notable inventor recognized for his contributions to the field of ultrasonic technologies. With a patent to his name, he has made significant advancements that have the potential to enhance various applications in medical imaging and materials testing.

Latest Patents: Takai Shimura holds a patent for an innovative Ultrasonic Sector-Scan Probe. This device comprises an array with multiple ultrasonic transducer segments, a window for transmitting and receiving ultrasonic waves, and a propagation medium for ultrasonic waves located in the front space between the array and the window. The probe's design allows for the selective driving of ultrasonic transducer segments, enabling the convergence of emitted waves into a focused beam. The technology facilitates sector scanning by shifting the scan line to new angles while maintaining accuracy, thus providing detailed imaging of the member under test.

Career Highlights: As an inventor, Takai Shimura has dedicated his efforts to enhancing ultrasonic scanning techniques. His work at Fujitsu Corporation has allowed him to integrate his innovative ideas into practical applications, significantly benefiting industries that utilize imaging technology.

Collaborations: Throughout his career, Takai Shimura has collaborated with esteemed colleagues, including Hirohide Miwa and Hajime Hayashi. These partnerships within Fujitsu Corporation have fostered an environment of creativity and teamwork, further advancing the field of ultrasonic instrumentation.

Conclusion: Takai Shimura's contributions to the ultrasonic sector are a testament to his innovative spirit and technical prowess. His patent for the Ultrasonic Sector-Scan Probe reflects a sophisticated understanding of ultrasonic technology, promising to yield better imaging solutions in various applications and reinforce the importance of collaboration in the world of invention.

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