Tokyo, Japan

Takahisa Kusaka

This inventor holds 7 USPTO granted patents. Top assignee: Sony Corporation. Active years: 1994-2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahisa Kusaka. Retrieved from https://idiyas.com/inventor/takahisa-kusaka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 6

Forward Citations = 91(Granted Patents)


Company Filing History:


Years Active: 1994-2000

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7 patents (USPTO):Explore Patents

Title: Takahisa Kusaka: Innovator in Semiconductor Technology

Introduction

Takahisa Kusaka is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work has been instrumental in advancing the manufacturing processes of semiconductor wafers.

Latest Patents

Among his latest patents is a groundbreaking invention related to semiconductor wafers and methods of manufacturing them. This invention involves an epitaxial layer formed on the surface of a semiconductor substrate. A second element, homologous to the first element constituting the semiconductor substrate, is present with a peak concentration on the semiconductor substrate side rather than the surface. This peak concentration is defined as being 1.times.10.sup.16 atoms/cm.sup.3 or more.

Career Highlights

Takahisa Kusaka is currently employed at Sony Corporation, where he continues to innovate and develop new technologies. His expertise in semiconductor manufacturing has positioned him as a key player in the industry.

Collaborations

Throughout his career, Takahisa has collaborated with notable colleagues, including Hideo Kanbe and Masanori Ohashi. These collaborations have further enhanced his contributions to semiconductor technology.

Conclusion

Takahisa Kusaka's work in semiconductor technology exemplifies innovation and dedication. His patents and collaborations reflect his commitment to advancing the field, making him a significant figure in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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