Tsukuba, Japan

Takahiro Imura

This inventor holds 1 USPTO granted patent. Top assignee: Texas Instruments Corporation. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahiro Imura. Retrieved from https://idiyas.com/inventor/takahiro-imura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Takahiro Imura: Innovator in Semiconductor Technology

Introduction

Takahiro Imura is a notable inventor based in Tsukuba, Japan. He has made significant contributions to the field of semiconductor technology. His innovative work focuses on enhancing the design and functionality of semiconductor devices.

Latest Patents

Takahiro Imura holds 1 patent for a semiconductor device. This invention aims to prevent the contact of adjacent wires when a molding resin is poured to form the external shape of a semiconductor package. The device includes a semiconductor chip with a row of electrode pads along its periphery, wires extending from these pads, and a molding resin package material that covers the chip and wires. Additionally, dam members are arranged between the closest wires to ensure the corners of the semiconductor chip are properly positioned.

Career Highlights

Imura is associated with Texas Instruments Corporation, a leading company in the semiconductor industry. His work has contributed to advancements in semiconductor packaging and design, showcasing his expertise in this technical field.

Collaborations

Takahiro has collaborated with notable coworkers, including Norito Umehara and Yoshikatsu Umeda. Their combined efforts have furthered the development of innovative semiconductor solutions.

Conclusion

Takahiro Imura's contributions to semiconductor technology exemplify the importance of innovation in this rapidly evolving field. His patent reflects a commitment to improving device functionality and reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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