The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2001
Filed:
Aug. 03, 1999
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
To prevent the contact of adjacent wires when a molding resin for forming the external shape of a semiconductor package is poured. The semiconductor device of the present invention is equipped with a semiconductor chip,that has a row of electrode pads 13,along the periphery of the principal plane, wires,that extend from each of the electrode pads 13,, a molding resin package material,that covers at least the above-mentioned semiconductor chip,and the wires,and that forms the external shape of the semiconductor device, and dam members that are arranged between the two closest of the above-mentioned wires 14,and 14,, which are arranged so that the corners of the above-mentioned semiconductor chip are inserted in between the wires, that is, the dummy wires