Yokosuka, Japan

Takahiro Arakawa



Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 33(Granted Patents)


Company Filing History:


Years Active: 1990-2003

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2 patents (USPTO):Explore Patents

Title: Takahiro Arakawa: Innovator in Ultrasonic Flaw Detection

Introduction

Takahiro Arakawa is a prominent inventor based in Yokosuka, Japan. He has made significant contributions to the field of ultrasonic flaw detection, holding 2 patents that showcase his innovative approach to identifying defects in materials.

Latest Patents

Arakawa's latest patents include an ultrasonic flaw detection method and apparatus. This method involves irradiating wideband longitudinal ultrasonic waves from a generator probe onto a weld portion of coarse-grained material. By analyzing the waveforms of flaw detection echoes, he extracts the highest frequency component using time frequency analysis. Subsequent frequency components are extracted and multiplied to detect defect portion echoes, providing valuable information about defects in the weld. Another notable patent is a probe for ultrasonic flaw detectors, which features a transducer bonded with a heat-resisting brazing or soldering material. This design allows the probe to function effectively in both high and low temperature ranges, making it versatile for various testing modes.

Career Highlights

Takahiro Arakawa is associated with Ishikawajima-Harima Heavy Industries Co., Ltd., where he applies his expertise in ultrasonic technology. His work has significantly advanced the capabilities of flaw detection in industrial applications.

Collaborations

Arakawa collaborates with notable colleagues, including Hiroaki Hatanaka and Saburo Shibata, contributing to a dynamic team focused on innovation in engineering.

Conclusion

Takahiro Arakawa's contributions to ultrasonic flaw detection exemplify his commitment to innovation and excellence in engineering. His patents reflect a deep understanding of material science and technology, positioning him as a key figure in his field.

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