This inventor holds 1 USPTO granted patent. Top assignee: Hitachi, Ltd.. Active years: 1986.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1986
Title: Takahiko Ohkohchi: Innovator in Thick Film Circuit Board Technology
Introduction
Takahiko Ohkohchi is a notable inventor based in Katsuta, Japan. He has made significant contributions to the field of circuit board technology, particularly with his innovative designs that enhance performance and reliability.
Latest Patents
Ohkohchi holds a patent for a thick film circuit board. This invention comprises parts of a silicon carbide (SiC) substrate, which features a thick film resistor coated with a glass layer. This glass layer exhibits excellent adhesion to the SiC substrate and shares a similar coefficient of thermal expansion. The design ensures that no swelling, cracking, or peeling occurs on the thick film resistor, and it prevents the formation of electroconductive components on laser-trimmed parts of the resistor.
Career Highlights
Takahiko Ohkohchi is associated with Hitachi, Ltd., a leading company in technology and innovation. His work at Hitachi has allowed him to focus on developing advanced materials and circuit board technologies that meet the demands of modern electronics.
Collaborations
Ohkohchi has collaborated with notable colleagues, including Nobuyuki Sugishita and Hideo Suzuki. These partnerships have contributed to the advancement of technology in their respective fields.
Conclusion
Takahiko Ohkohchi's contributions to thick film circuit board technology exemplify his innovative spirit and dedication to enhancing electronic components. His work continues to influence the industry and pave the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile