The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 1986

Filed:

Dec. 29, 1983
Applicant:
Inventors:

Nobuyuki Sugishita, Yokosuka, JP;

Hideo Suzuki, Katsuta, JP;

Takahiko Ohkohchi, Katsuta, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; B32B / ; B32B / ;
U.S. Cl.
CPC ...
428209 ; 428446 ; 428698 ; 428901 ; 428428 ; 174 685 ;
Abstract

A thick film circuit board comprises at least parts of SiC substrate at which a thick film resistor is provided being coated with a glass layer having a good adhesion to the SiC substrate and the same or similar coefficient of thermal expansion as or to that of the SiC substrate, and no swelling, cracking and peeling appear on the thick film resistor and no electroconductive component is formed on laser-trimmed parts of the thick film resistor.


Find Patent Forward Citations

Sugishita, Nobuyuki. (1986). Thick film circuit board (U.S. Patent No. 4581279). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4581279

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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