This inventor holds 10 USPTO granted patents, plus 1 CIPO patent and 4 EPO patents. Top assignees: Nisshinbo Chemical Inc., Mitsubishi Denki Kabushiki Kaisha, Nisshinbo Industries, Inc.. Active years: 2001-2025.
Location History:
- Tokyo, JP (2001 - 2006)
- Chiba, JP (2001 - 2020)
Company Filing History:
6 out of 23 
2 out of 21,351 
2 out of 423 Years Active: 2001-2025
Title: Takahiko Itoh: Innovator in Polycarbodiimide Compounds
Introduction
Takahiko Itoh is a prominent inventor based in Chiba, Japan, known for his significant contributions to the field of polymer chemistry. He holds a total of 10 patents, showcasing his innovative spirit and dedication to advancing technology in materials science.
Latest Patents
Among his latest patents, Takahiko Itoh has developed a polycarbodiimide compound that enables the creation of an aqueous resin composition. This composition is capable of forming a coating with excellent water resistance and adhesion, suitable for food packaging applications. His work includes a detailed formulation of the polycarbodiimide compound, which involves specific residues derived from hydrophilic compounds and aliphatic diisocyanates. Additionally, he has created a carbodiimide-based aqueous resin crosslinking agent that exhibits remarkable storage stability when coexisting with aqueous resins.
Career Highlights
Takahiko Itoh has worked with notable companies such as Nisshinbo Chemical Inc. and Mitsubishi Electric Corporation. His experience in these organizations has allowed him to refine his expertise in polymer chemistry and contribute to various innovative projects.
Collaborations
Throughout his career, Takahiko has collaborated with esteemed colleagues, including Ikuo Takahashi and Takahiro Sasaki. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Takahiko Itoh's work in the field of polycarbodiimide compounds and aqueous resin compositions highlights his role as a key innovator in materials science. His contributions continue to impact the industry, particularly in food packaging solutions.