Nisshinbo Chemical Inc.

Mitsubishi Denki Kabushiki Kaisha

Nisshinbo Industries, Inc.

Takahiko Itoh

Ikuo Takahashi

Takahiro Sasaki

Yasuo Imashiro

Katsuhiro Shimizu

Hideshi Tomita

Satoshi Kajiya

Nobuyuki Matsumoto

Kazuo Saito

Yoshihiro Yamazaki

Satoshi Amano

Norimasa Nakamura

Nami Tsukamoto

Shinichi Nakashima

Saori Kotani

Akira Taniguchi

Shunta Nakajima

Provided are a polycarbodiimide compound that enables an aqueous resin composition capable of forming a coating (layer) having water resistance and adhesion that can withstand use for food packaging to be obtained, an aqueous resin composition containing the polycarbodiimide compound, and a food packaging having a layer formed of the aqueous resin composition. A polycarbodiimide compound (A) represented by formula (1) below, wherein Rrepresents a residue obtained by removing a functional group capable of reacting with isocyanate from a hydrophilic compound having the functional group capable of reacting with isocyanate, Rrepresents a divalent residue obtained by removing an isocyanate group from an aliphatic diisocyanate compound, and Rrepresents a divalent residue obtained by removing a hydroxyl group from a glycol compound having 2 or 3 carbon atoms; X represents a group that is formed by reaction between the hydrophilic compound and the aliphatic diisocyanate compound; n1 represents a number of 1 to 10, n2 represents a number of 1 to 10, and p represents a number of 2 to 4; and a plurality of Rand Reach may be the same or different.

Polycarbodiimide compound, aqueous resin composition and food packaging container

A carbodiimide-based aqueous resin crosslinking agent excellent in the storage stability in the coexistence of an aqueous resin, comprising a polycarbodiimide (A) having substituents derived from hydrophilic organic compounds at both terminals thereof, at least one of the substituents being a substituent derived from a hydrophilic organic compound having a molecular weight of 340 or more, and a polycarbodiimide (B) having substituents derived from organic compounds having a molecular weight of 300 or less at both terminals thereof, wherein the mass ratio [(B)/(A)] of the polycarbodiimide (B) to the polycarbodiimide (A) is from 20/80 to 95/5.

Carbodiimide-based aqueous resin crosslinking agent

The modified polycarbodiimide compound of the present invention is obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with at least one aliphatic amine selected from the group consisting of diethylamine, methylisopropylamine, tert-butylethylamine, di-sec-butylamine, dicyclohexylamine, 2-methylpiperidine and 2,6-dimethylpiperidine. The curing agent of the present invention comprises the modified polycarbodiimide compound of the present invention. The thermosetting resin composition of the present invention comprises a carboxyl group-containing resin having a carboxyl group in a molecule or an epoxy resin having two or more epoxy groups in one molecule, and the curing agent of the present invention. Thus, a modified polycarbodiimide compound that can allow a resin composition to be cured at a relatively low temperature and that can suppress curing of a resin composition in a drying step before a thermal curing step of a resin composition, a curing agent comprising the modified polycarbodiimide compound, and a thermosetting resin composition comprising the curing agent can be provided.

Modified polycarbodiimide compound, curing agent, and thermosetting resin composition

The modified polycarbodiimide compound of the present invention is obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with an aromatic heterocyclic compound having endocyclic secondary amine nitrogen. The curing agent of the present invention comprises the modified polycarbodiimide compound of the present invention. Thus, a modified polycarbodiimide compound that allows amine dissociation to start at a low temperature as compared with a modified polycarbodiimide compound obtained by modifying a polycarbodiimide compound derived from a diisocyanate compound with diisopropylamine, and a curing agent comprising the modified polycarbodiimide compound can be provided.

The present invention provides an epoxy resin composition, which is improved in terms of storage stability without deteriorating the characteristics of a cured resin, and is also superior in handling property, by using a curing accelerator having higher latency. The epoxy resin composition of the present invention comprises an epoxy resin, a curing agent, and a curing accelerator, wherein the curing accelerator is a reaction product between a carbodiimide compound and an imidazole compound, and is contained in an amount of 0.1 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin.

Epoxy resin composition

The present invention relates to a process for producing a polyester resin composition, including the step of mixing a polyester resin (A), an aromatic carbodiimide (B) and an aliphatic polycarbodiimide (C) at a temperature not lower than a melting temperature of the polyester resin, in which the polyester resin (A) and the aromatic carbodiimide (B) are mixed in the presence of the aliphatic polycarbodiimide (C).

Method for producing polyester resin composition

The optical amplifier apparatus comprises an optical amplifier () which amplifies an input signal light, an output detecting unit () which detects an output level of the optical amplifier, an output control unit () which controls an output level of the optical amplifier according to an output level detected by the output detecting unit (), a gain inclination detecting unit () which detects a gain inclination relating to a wavelength of the optical amplifier, and a gain inclination control unit () which controls a gain inclination of the optical amplifier () according to a gain inclination detected by the gain inclination detecting unit ().

Optical amplifier device

The optical amplifier apparatus comprises an optical amplifier which amplifies an input signal light, an output detecting unit which detects an output level of the optical amplifier, an output control unit which controls an output level of the optical amplifier according to an output level detected by the output detecting unit, a gain inclination detecting unit which detects a gain inclination relating to a wavelength of the optical amplifier, and a gain inclination control unit which controls a gain inclination of the optical amplifier according to a gain inclination detected by the gain inclination detecting unit.

Optical amplifier apparatus

The present invention provides a method of adhering adherends, including (i) providing at least two adherends at least one of which is made of a flexible material, and (ii) joining the adherends together to form a structure using a heat-resistant adhesive composition containing mainly 1) a polycarbodiimide resin and an epoxy resin, or 2) a polycarbodiimide resin, an epoxy resin and a curing agent for the polycarbodiimide resin, or 3) a polycarbodiimide resin, an epoxy resin and a curing agent for the epoxy resin. The heat-resistant adhesive composition can be applied under mild conditions, and the resultant structure has excellent heat resistance and chemical resistance, and has superior adhesion strength particularly at high temperatures.

Method of adhering adherends

A method for bonding LCPs mutually or an LCP and another material comprising the step of bonding LCPs mutually or an LCP and another material using an adhesive prepared by adding a polycarbodiimide resin with an epoxy resin composition comprising an epoxy resin and a curing agent, thereby providing excellent adhesion and heat resistance.

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Chiba, Japan

Takahiko Itoh