This inventor holds 1 USPTO granted patent. Top assignee: Denso Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Takahide Kato: Semiconductor Module Inventor.
Introduction
Takahide Kato is an inventor based in Kariya-city, Japan, and is associated with Denso Corporation. His work includes a patented semiconductor module design. The available information lists 1 patent.
Latest Patents
Kato’s patent, “Semiconductor module,” describes a module containing a semiconductor element, a heat dissipation member, a resin member, a signal terminal, and a wiring member. The heat dissipation member is thermally connected to the semiconductor element, with at least part of it exposed from the resin member. The wiring member is more flexible than the signal terminal and consists of an electrically insulating resin layer supporting a metal layer. It connects a signal pad on the semiconductor element to the signal terminal.
Career Highlights
Kato’s listed invention addresses the arrangement of electrical connections and heat dissipation within a resin-encapsulated semiconductor module. He is associated with Denso Corporation, a company known for automotive technology and components.
Collaborations
Hirotoshi Kusama and Naruhiro Inoue are identified as Kato’s coworkers. The available information does not specify their roles in the patent.
Conclusion
Takahide Kato’s semiconductor module patent describes a design that combines heat dissipation with flexible electrical wiring in an encapsulated assembly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
