Kariya-city, Japan

Takahide Kato

This inventor holds 1 USPTO granted patent. Top assignee: Denso Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahide Kato. Retrieved from https://idiyas.com/inventor/takahide-kato-9wvgude6

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Takahide Kato: Semiconductor Module Inventor.

Introduction

Takahide Kato is an inventor based in Kariya-city, Japan, and is associated with Denso Corporation. His work includes a patented semiconductor module design. The available information lists 1 patent.

Latest Patents

Kato’s patent, “Semiconductor module,” describes a module containing a semiconductor element, a heat dissipation member, a resin member, a signal terminal, and a wiring member. The heat dissipation member is thermally connected to the semiconductor element, with at least part of it exposed from the resin member. The wiring member is more flexible than the signal terminal and consists of an electrically insulating resin layer supporting a metal layer. It connects a signal pad on the semiconductor element to the signal terminal.

Career Highlights

Kato’s listed invention addresses the arrangement of electrical connections and heat dissipation within a resin-encapsulated semiconductor module. He is associated with Denso Corporation, a company known for automotive technology and components.

Collaborations

Hirotoshi Kusama and Naruhiro Inoue are identified as Kato’s coworkers. The available information does not specify their roles in the patent.

Conclusion

Takahide Kato’s semiconductor module patent describes a design that combines heat dissipation with flexible electrical wiring in an encapsulated assembly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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