The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Apr. 10, 2024
Denso Corporation, Kariya-city, JP;
Hirotoshi Kusama, Kariya-city, JP;
Naruhiro Inoue, Kariya-city, JP;
Shuna Nagai, Kariya-city, JP;
Keita Fukutani, Kariya-city, JP;
Yasushi Furukawa, Kariya-city, JP;
Takahide Kato, Kariya-city, JP;
Shunsuke Arai, Kariya-city, JP;
Ryota Miwa, Kariya-city, JP;
Shoichiro Omae, Kariya-city, JP;
DENSO CORPORATION, Kariya-city, JP;
Abstract
A semiconductor module includes a semiconductor element, a heat dissipation member thermally connected to the semiconductor element, a resin member, a signal terminal, and a wiring member. The resin member accommodates the semiconductor element, the heat dissipation member, and the wiring member. At least a part of the heat dissipation member is exposed from the resin member. The wiring member is a member more flexible than the signal terminal, and includes an electrically insulating resin layer and a metal layer supported by the resin layer. The wiring member connects a signal pad of the semiconductor element and the signal terminal.