This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Denso Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Hirotoshi Kusama: Innovator in Semiconductor Technology
Introduction
Hirotoshi Kusama is a notable inventor based in Kariya-city, Japan. He has made significant contributions to the field of semiconductor technology. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
Hirotoshi Kusama's recent patent applications include two significant inventions. The first is a SEMICONDUCTOR DEVICE, which features a sealing body that encapsulates a semiconductor element, wiring member, signal terminals, relay substrate, and bonding wires. The bonding wires serve to electrically connect the pads of the semiconductor element to the lands of the relay substrate. The wiring member is designed with a front-face metal body that includes both a wiring portion and an island portion, which is electrically isolated from the wiring portion. The semiconductor element is positioned on the wiring portion, while the relay substrate is situated on the island portion.
The second application is for a SEMICONDUCTOR MODULE. This module comprises a semiconductor element, a heat dissipation member that is thermally connected to the semiconductor element, a resin member, a signal terminal, and a wiring member. The resin member houses the semiconductor element, heat dissipation member, and wiring member, with part of the heat dissipation member exposed from the resin. The wiring member is more flexible than the signal terminal and consists of an electrically insulating resin layer and a metal layer supported by the resin layer. This wiring member connects the signal pad of the semiconductor element to the signal terminal.
Conclusion
Hirotoshi Kusama is an innovative inventor whose work in semiconductor technology showcases his potential in the field. His latest patent applications reflect his commitment to advancing technology, even in the absence of granted patents. His contributions may pave the way for future developments in semiconductor devices and modules.