Sagamihara, Japan

Takafumi Kudou


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2001

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2 patents (USPTO):Explore Patents

Title: Discovering the Innovations of Takafumi Kudou

Introduction

Takafumi Kudou is a notable inventor based in Sagamihara, Japan. With a focus on advanced materials and processes, he has made significant contributions to the field of printed wiring boards through his innovative patents. His work continues to influence technology and manufacturing within the electronics industry.

Latest Patents

Takafumi Kudou holds two patents, both related to laminate films and their applications in preparing printed wiring boards. His latest patent details a laminate film that features a photosensitive layer and a first film with specific elongation properties. The film exhibits a 5% elongation load in the longitudinal direction of 4 to 90 g/mm at 80°C, along with a breaking elongation that ranges from 50% to 1,000%. The processes outlined for preparing a printed wiring board involve laminating the film onto a substrate to ensure contact between the photosensitive layer and the substrate, followed by exposure and development. This innovation enhances the efficiency and reliability in the fabrication of printed wiring boards.

Career Highlights

Takafumi Kudou is employed by Hitachi Chemical Company, a leading organization in the production of advanced materials and chemicals. His role within the company has allowed him to explore and develop pioneering technologies that contribute to the design and manufacturing of electronic components.

Collaborations

Throughout his career, Kudou has collaborated with esteemed professionals in his field, including Noriyo Kimura and Youji Tanaka. These collaborations have fostered a productive environment for innovation and have led to the advancement of technologies utilized by the electronics industry.

Conclusion

Takafumi Kudou’s work is a testament to the impact of innovation in the realm of materials science and electronics. His patents not only reflect his expertise but also his commitment to fostering technologies that improve manufacturing processes. As the industry evolves, his contributions will continue to resonate within the field of printed wiring boards and beyond.

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