Hitachi Chemical Company, Ltd.

Takafumi Kudou

Tetsuo Yoshida

Youji Tanaka

Yukihiko Minamihira

Noriyo Kimura

Kazutaka Masaoka

Provided are a laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80&deg; C. of 4 to 90 g/mm and a breaking elongation in the longitudinal direction of the film per unit width of 50 to 1,000%, and processes for preparing a printed wiring board, which comprises laminating the laminate film on a substrate so that the photosensitive layer and the substrate are contacted with each other; and then subjecting a resulting material to exposure and development.

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Sagamihara, Japan

Takafumi Kudou