The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2001
Filed:
Jan. 29, 1999
Noriyo Kimura, Hitachi, JP;
Youji Tanaka, Hitachi, JP;
Kazutaka Masaoka, Hitachi, JP;
Takafumi Kudou, Sagamihara, JP;
Yukihiko Minamihira, Sagamihara, JP;
Tetsuo Yoshida, Sagamihara, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Abstract
Provided are a laminate film which comprises a photosensitive layer and a first film having a 5% elongation load in the longitudinal direction of the film per unit width at 80° C. of 4 to 90 g/mm and a breaking elongation in the longitudinal direction of the film per unit width of 50 to 1,000%, and processes for preparing a printed wiring board, which comprises laminating the laminate film on a substrate so that the photosensitive layer and the substrate are contacted with each other; and then subjecting a resulting material to exposure and development.