This inventor holds 1 USPTO granted patent. Top assignee: Wacker Chemie Ag. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Taishi Uchida: Thermally Conductive Silicone Innovation.
Introduction
Taishi Uchida is an inventor associated with Wacker Chemie AG and based in Chikusei, Japan. His patent work includes a thermally conductive silicone composition designed for producing gap fillers.
Latest Patents
Uchida is credited with 1 patent: “Thermally Conductive Silicone Composition and Method for Producing Gap Filler Using Said Composition.” The invention describes a two-component thermally conductive silicone composition, along with methods for producing and using it.
The first liquid contains an alkenyl-functional diorganopolysiloxane, an addition catalyst, a thermally conductive filler, and a condensation catalyst. The second liquid contains the alkenyl-functional diorganopolysiloxane, a silicon-bonded-hydrogen diorganopolysiloxane, a specified organosilicon compound or its hydrolysate, and a thermally conductive filler. The composition is intended for making gap fillers.
Career Highlights
Uchida’s listed patent reflects work on silicone materials and thermal management. The disclosed two-part formulation combines silicone components and conductive filler, with the aim of supporting gap-filler production.
Collaborations
Uchida’s listed coworkers include Kazuya Sakai and Yukihiko Asakawa. His company affiliation is Wacker Chemie AG.
Conclusion
Taishi Uchida’s patent documents an approach to producing thermally conductive silicone gap fillers through a two-component composition, highlighting his contribution to materials innovation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile