The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Aug. 17, 2022
Thermally conductive silicone composition and method for producing gap filler using said composition
Wacker Chemie Ag, Munich, DE;
Nazuna Terashita, Chikusei, JP;
Yukihiko Asakawa, Chikusei, JP;
Kazuya Sakai, Chikusei, JP;
Yusuke Suzuki, Chikusei, JP;
Taishi Uchida, Chikusei, JP;
Wacker Chemie AG, Munich, DE;
Abstract
A two-component thermally conductive silicone composition long with methods of producing and uses for the same. Where the two-component thermally conductive silicone includes a first liquid containing (A) a diorganopolysiloxane having an alkenyl group bonded to a silicon atom, (D) an addition catalyst, (E) a thermally conductive filler, and (F) a condensation catalyst. Where the two-component thermally conductive silicone includes a second liquid containing (A) the diorganopolysiloxane having an alkenyl group bonded to a silicon atom, (B) a diorganopolysiloxane having a hydrogen atom bonded to a silicon atom, (C) at least one selected from (C-1) an organosilicon compound having two or more groups that are at least one selected from a methoxy group and an ethoxy group and not having a hydrocarbon group having 3 or more carbon atoms or a vinyl group, and (C-2) a hydrolysate of the organosilicon compound (C-1), and (E) the thermally conductive filler.