This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2011.
Company Filing History:
Years Active: 2011
Title: Taek-Hoon Lee: Innovator in Semiconductor Packaging
Introduction
Taek-Hoon Lee is a prominent inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods. His work is particularly recognized for enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
One of Taek-Hoon Lee's notable patents is titled "Semiconductor package having resin substrate with recess and method of fabricating the same." This invention features a resin substrate that includes a first recess, a first interconnection on the surface of the recess, and a first semiconductor chip positioned within the recess. The underfill resin layer fills the recess and covers the side surface of the semiconductor chip, ensuring electrical connectivity to the first interconnection. This innovative design aims to improve the performance and durability of semiconductor packages.
Career Highlights
Taek-Hoon Lee is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung allows him to work on cutting-edge technologies and contribute to advancements in semiconductor solutions. With a patent portfolio that includes 1 patent, he continues to push the boundaries of innovation in his field.
Collaborations
Some of Taek-Hoon Lee's coworkers include Eun-Chul Ahn and Pyoung-Wan Kim. Their collaborative efforts contribute to the development of advanced semiconductor technologies, fostering an environment of innovation and creativity.
Conclusion
Taek-Hoon Lee is a distinguished inventor whose work in semiconductor packaging has made a significant impact on the industry. His innovative designs and methods continue to shape the future of semiconductor technology.