The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Aug. 29, 2008
Chul-yong Jang, Gyeonggi-do, KR;
Eun-chul Ahn, Gyeonggi-do, KR;
Pyoung-wan Kim, Gyeonggi-do, KR;
Taek-hoon Lee, Gyeonggi-do, KR;
Chul-Yong Jang, Gyeonggi-do, KR;
Eun-Chul Ahn, Gyeonggi-do, KR;
Pyoung-Wan Kim, Gyeonggi-do, KR;
Taek-Hoon Lee, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
In one embodiment, a semiconductor package disclosed herein can be generally characterized as including a resin substrate having a first recess, a first interconnection disposed on a surface of the first recess, a first semiconductor chip disposed in the first recess, and an underfill resin layer substantially filling the first recess and covering a side surface of the first semiconductor chip. The first semiconductor chip is electrically connected to the first interconnection.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile