Tae Hyoung Cho

Title: Tae Hyoung Cho: Innovator in Substrate Cutting Technology

Introduction

Tae Hyoung Cho is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of substrate cutting technology, holding two patents that showcase his innovative approach.

Latest Patents

His latest patents include a method for cutting a substrate. This method involves radiating a laser towards the surface of the substrate to form a first groove. The process includes sequentially radiating the laser towards several points: a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP). Each of these points is spaced apart by specific distances, with the FCP corresponding to the cut line of the substrate. The FOP and SOP are positioned at the lateral sides of the FCP, while the FIP and SIP are located between the FCP and the respective outer points. The same type and intensity of laser is used for each point, ensuring precision in the cutting process.

Career Highlights

Tae Hyoung Cho has worked with prominent companies in the technology sector, including Samsung Display Co., Ltd. and Philoptics Co., Ltd. His experience in these organizations has contributed to his expertise in substrate cutting technologies.

Collaborations

Some of his notable coworkers include Il Young Jeong and Tae Yong Kim, who have collaborated with him on various projects.

Conclusion

Tae Hyoung Cho's innovative methods in substrate cutting demonstrate his significant impact on the field. His patents reflect a commitment to advancing technology and improving manufacturing processes.