The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Jan. 04, 2016
Samsung Display Co., Ltd., Yongin-si, KR;
Philoptics Co., Ltd., Suwon-si, KR;
Il Young Jeong, Suwon-si, KR;
Tae Yong Kim, Asan-si, KR;
Cheol Lae Roh, Asan-si, KR;
Je Kil Ryu, Hwaseong-si, KR;
Jeong Hun Woo, Seongnam-si, KR;
Gyoo Wan Han, Yongin-si, KR;
Ki Su Han, Anyang-si, KR;
Tae Hyoung Cho, Suwon-si, KR;
Jong Nam Moon, Suwon-si, KR;
Samsung Display Co., Ltd., Yongin-si, KR;
Philoptics Co., Ltd., Suwon-si, KR;
Abstract
A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.