Jeong Hun Woo

Title: Jeong Hun Woo: Innovator in Substrate Cutting Technology

Introduction

Jeong Hun Woo is a notable inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of substrate cutting technology, holding two patents that showcase his innovative methods. His work has implications for various industries, particularly in manufacturing and materials processing.

Latest Patents

Jeong Hun Woo's latest patents focus on a method for cutting substrates using laser technology. This method involves radiating a laser towards the surface of the substrate to create a first groove. The process includes a sequence of radiating the laser towards several designated points: a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP). Each of these points is strategically spaced apart, with the FCP corresponding to the cut line of the substrate. The FOP and SOP are positioned at the lateral sides of the FCP, while the FIP and SIP are located between the FCP and their respective outer points. The same type and intensity of laser is applied to each point, ensuring precision in the cutting process.

Career Highlights

Throughout his career, Jeong Hun Woo has worked with prominent companies, including Samsung Display Co., Ltd. and Philoptics Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in substrate cutting technology.

Collaborations

Jeong Hun Woo has collaborated with several professionals in his field, including Il Young Jeong and Tae Yong Kim. These collaborations have fostered innovation and the sharing of ideas, further enhancing the development of cutting-edge technologies.

Conclusion

Jeong Hun Woo is a distinguished inventor whose work in substrate cutting technology has made a significant impact. His innovative methods and collaborations with industry professionals continue to drive advancements in this field.