Tae Hoan Jang

Title: Tae Hoan Jang: Innovator in Semiconductor Technology

Introduction

Tae Hoan Jang is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on improving the efficiency and performance of semiconductor packages.

Latest Patents

One of Tae Hoan Jang's latest patents is a semiconductor package and method for fabricating the same. This innovation includes a semiconductor chip with a first and second face, where the first face has multiple input/output pads. The design features a circuit board made of a resin film, which includes a circuit pattern layer with bond fingers and ball lands. The circuit board has a through hole at its center, allowing the semiconductor chip to be placed within it. The electrical connection means facilitate the connection between the input/output pads of the semiconductor chip and the bond fingers of the circuit board. An encapsulant is used to encapsulate the semiconductor chip, connection means, and part of the circuit board, while conductive balls are fused to the circuit board. This design results in a very thin semiconductor package with improved heat spreading performance.

Career Highlights

Tae Hoan Jang has worked with notable companies in the semiconductor industry, including Amkor Technology, Inc. His experience in these organizations has contributed to his expertise and innovative capabilities in semiconductor technology.

Collaborations

Some of his notable coworkers include Won Sun Shin and Seon Goo Lee. Their collaboration has likely played a role in advancing the projects they have worked on together.

Conclusion

Tae Hoan Jang is a key figure in the semiconductor industry, with a focus on creating efficient and high-performance semiconductor packages. His contributions through his patents reflect his commitment to innovation in technology.