Tae-ho Cha

Title: The Innovative Contributions of Tae-ho Cha

Introduction

Tae-ho Cha is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on methods of fabricating semiconductor devices, which are crucial for modern electronics.

Latest Patents

Tae-ho Cha's latest patents include a method of fabricating a semiconductor device having buried wiring. This method involves forming a trench in a semiconductor substrate and applying a first conductive layer on the trench's surfaces. A second conductive layer is then selectively formed on the first layer using techniques such as electroless plating, metal organic chemical vapor deposition (MOCVD), or atomic layer deposition (ALD). Another notable patent is related to semiconductor devices and methods of fabricating them, specifically focusing on devices that incorporate a W–Ni alloy thin layer with low resistance. The composition of this alloy is carefully controlled, with nickel content ranging from approximately 0.01 to 5.0 wt % of the total weight.

Career Highlights

Tae-ho Cha is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to contribute to cutting-edge advancements in semiconductor technology, enhancing the performance and efficiency of electronic devices.

Collaborations

Throughout his career, Tae-ho Cha has collaborated with notable colleagues, including Jong-Min Baek and Hee-Sook Park. These collaborations have fostered innovation and have been instrumental in the development of new technologies in the semiconductor field.

Conclusion

Tae-ho Cha's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the industry. His advancements continue to influence the development of modern electronic devices.