This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Innovative Insights into Tae-Heon Lee’s Contribution to Semiconductor Packaging
Introduction
Tae-Heon Lee is a prominent inventor located in Seoul, South Korea. He has made significant strides in the field of semiconductor technology, with a focus on enhancing the design and functionality of three-dimensional semiconductor packages. His innovative approach not only contributes to the realm of electronics but also sets a benchmark for future developments in the industry.
Latest Patents
Tae-Heon Lee currently holds one patent titled "Method and system for designing 3D semiconductor package." This inventive method outlines a comprehensive process that involves several key parameters, such as first and second package layout parameters, which are crucial for creating a multi-layer semiconductor package. The patent includes specific wiring connection layouts that utilize different processing techniques, ensuring optimized electrical connectivity between terminal packages.
Career Highlights
Tae-Heon Lee has established himself as a valuable asset to Samsung Electronics Co., Ltd., where he continues to work on groundbreaking projects that align with the company’s vision for innovative electronics. His expertise in semiconductor packaging plays a crucial role in the advancement of technology, helping to meet the increasing demands for efficiency and performance in electronic devices.
Collaborations
Throughout his career, Tae-Heon Lee has worked alongside esteemed colleagues, including Bo-Sun Hwang and Sung-Hee Yun. This collaborative environment fosters creativity and innovation, enabling them to explore new ideas and drive advances in semiconductor technology further.
Conclusion
Tae-Heon Lee’s contributions to semiconductor packaging represent a significant leap forward in the field of electronics. His patented method and systematic approach to designing three-dimensional semiconductor packages showcase the potential for innovation that can pave the way for future technological advancements. As he continues to work at Samsung Electronics Co., Ltd., stakeholders in the industry eagerly anticipate what remarkable innovations he may bring next.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
