Seoul, South Korea

Tae-Heon Lee

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tae-Heon Lee. Retrieved from https://idiyas.com/inventor/tae-heon-lee-2z8tmbaj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2014

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovative Insights into Tae-Heon Lee’s Contribution to Semiconductor Packaging

Introduction

Tae-Heon Lee is a prominent inventor located in Seoul, South Korea. He has made significant strides in the field of semiconductor technology, with a focus on enhancing the design and functionality of three-dimensional semiconductor packages. His innovative approach not only contributes to the realm of electronics but also sets a benchmark for future developments in the industry.

Latest Patents

Tae-Heon Lee currently holds one patent titled "Method and system for designing 3D semiconductor package." This inventive method outlines a comprehensive process that involves several key parameters, such as first and second package layout parameters, which are crucial for creating a multi-layer semiconductor package. The patent includes specific wiring connection layouts that utilize different processing techniques, ensuring optimized electrical connectivity between terminal packages.

Career Highlights

Tae-Heon Lee has established himself as a valuable asset to Samsung Electronics Co., Ltd., where he continues to work on groundbreaking projects that align with the company’s vision for innovative electronics. His expertise in semiconductor packaging plays a crucial role in the advancement of technology, helping to meet the increasing demands for efficiency and performance in electronic devices.

Collaborations

Throughout his career, Tae-Heon Lee has worked alongside esteemed colleagues, including Bo-Sun Hwang and Sung-Hee Yun. This collaborative environment fosters creativity and innovation, enabling them to explore new ideas and drive advances in semiconductor technology further.

Conclusion

Tae-Heon Lee’s contributions to semiconductor packaging represent a significant leap forward in the field of electronics. His patented method and systematic approach to designing three-dimensional semiconductor packages showcase the potential for innovation that can pave the way for future technological advancements. As he continues to work at Samsung Electronics Co., Ltd., stakeholders in the industry eagerly anticipate what remarkable innovations he may bring next.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…