The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2014
Filed:
Mar. 14, 2013
Samsung Electronics Co., Ltd., Suwon-si, KR;
Bo-Sun Hwang, Yongin-si, KR;
Sung-Hee Yun, Seoul, KR;
Jae-Hoon Jeong, Hwaseong-si, KR;
Won-Cheol Lee, Seoul, KR;
Tae-Heon Lee, Seoul, KR;
Young-Hoe Cheon, Suwon-si, KR;
Abstract
A three-dimensional semiconductor package and method for making the same include providing a first package layout parameter for a plurality of first terminals included in a first package, a second package layout parameter for a plurality of second terminals included in a second package disposed above or below the first package, and a connection terminal layout parameter for a plurality of connection terminals electrically connecting the first package and the second package; providing a first wiring connection layout between the first and second terminals and the connection terminals by applying a first process to the first package, second package, and connection terminal layout parameters; and providing a second wiring connection layout between the first and second terminals and the connection terminals by applying a second process, which is different from the first process, to the first wiring connection layout.